Invention Grant
- Patent Title: CMP slurry composition for copper films and method of polishing copper films using the same
-
Application No.: US17072385Application Date: 2020-10-16
-
Publication No.: US11746258B2Publication Date: 2023-09-05
- Inventor: Hyeong Mook Kim , Keun Sam Jang , Dong Hun Kang , Jong Won Lee
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20190130274 2019.10.18
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K13/06 ; C23F3/00 ; H01L21/321 ; C01B33/12
Abstract:
A CMP slurry composition for copper films and a method of polishing a copper film using the same are disclosed, the composition including a polar solvent or a non-polar solvent; and polishing particles modified with a silicon-containing compound, wherein the silicon-containing compound is represented by Formula 1,
Public/Granted literature
- US20210115296A1 CMP SLURRY COMPOSITION FOR COPPER FILMS AND METHOD OF POLISHING COPPER FILMS USING THE SAME Public/Granted day:2021-04-22
Information query
