Invention Grant
- Patent Title: High compressive strength sound attenuation
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Application No.: US16835692Application Date: 2020-03-31
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Publication No.: US11746541B2Publication Date: 2023-09-05
- Inventor: John Igo
- Applicant: Formulated Materials LLC
- Applicant Address: US OK Oklahoma City
- Assignee: Formulated Materials LLC
- Current Assignee: Formulated Materials LLC
- Current Assignee Address: US OK Oklahoma City
- Agency: McAfee & Taft
- Main IPC: E04F15/20
- IPC: E04F15/20

Abstract:
The present disclosure describes a sound attenuating flooring system. The sound attenuating flooring system has a subfloor, a sound attenuating material overlaying and contacting only a portion of the subfloor, and an overlayment. The sound attenuating material has a first surface and second surface. The first surface is defined by a plurality of outwardly projecting hollow protrusions. The second surface is defined by a plurality of open recesses corresponding to the plurality of outwardly projecting hollow protrusions. The overlayment overlays the second surface of the sound attenuating material.
Public/Granted literature
- US20200308850A1 HIGH COMPRESSIVE STRENGTH SOUND ATTENUATION Public/Granted day:2020-10-01
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