Invention Grant
- Patent Title: Fast heat-sinking device for evaporators
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Application No.: US17324094Application Date: 2021-05-18
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Publication No.: US11747091B2Publication Date: 2023-09-05
- Inventor: Chi-Feng Hsu , Cheng-Jen Liang , Chih-Wei Chen
- Applicant: LDC Precision Engineering CO., Ltd.
- Applicant Address: TW New Taipei
- Assignee: LDC PRECISION ENGINEERING CO., LTD.
- Current Assignee: LDC PRECISION ENGINEERING CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: LANWAY IPR SERVICES
- Agent Chun-Ming Shih
- Main IPC: F28D15/02
- IPC: F28D15/02 ; H05K7/20 ; F28F3/12 ; F28F3/02

Abstract:
A fast heat-sinking device for evaporators according to the present invention is disclosed, comprising at least one heat-sinking component which is formed by means of conjunctively assembling an outer wall board and an inner wall board; the interior of the outer wall board includes a semi-open first evaporation area; the interior of the inner wall board includes a semi-open second evaporation area, and the inner wall board is concavely configured with a gap; as such, the inner wall board is attached onto one side of the outer wall board thus further being assembled into the heat-sinking component, and the first evaporation area and the second evaporation area are connected in communication at the notch so as to together form an air concentration area, as a heat-sinking structure of the evaporator.
Public/Granted literature
- US20210270538A1 FAST HEAT-SINKING DEVICE FOR EVAPORATORS Public/Granted day:2021-09-02
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