Invention Grant
- Patent Title: Vapor chamber and heat dissipation device with same
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Application No.: US17889665Application Date: 2022-08-17
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Publication No.: US11747092B2Publication Date: 2023-09-05
- Inventor: Chih-Wei Chen , Chien-Fu Liu , Guan-Cing Liu
- Applicant: AURAS Technology Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: AURAS TECHNOLOGY CO., LTD.
- Current Assignee: AURAS TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: WPAT, P.C
- Priority: TW 8103904 2019.01.31
- The original application number of the division: US16733862 2020.01.03
- Main IPC: F28D15/04
- IPC: F28D15/04

Abstract:
A vapor chamber and a heat dissipation device with the vapor chamber are provided. The vapor chamber includes a first plate, a second plate, a first capillary strip, a first communication structure and a working medium. An accommodation space is defined by the first plate and the second plate collaboratively. The first capillary strip is installed in the accommodation space. The accommodation space is divided into a first region and a second region by the first capillary strip. The working medium is accommodated within the accommodation space. The working medium flows between the first region and the second region through the first communication structure. Since the working medium is guided to flow in the accommodation space by the first capillary strip and the first communication structure, the heat dissipating efficacy is enhanced.
Public/Granted literature
- US20220390184A1 VAPOR CHAMBER AND HEAT DISSIPATION DEVICE WITH SAME Public/Granted day:2022-12-08
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