Invention Grant
- Patent Title: Overmolded / through-molded holster
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Application No.: US16462308Application Date: 2018-03-26
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Publication No.: US11747107B2Publication Date: 2023-09-05
- Inventor: Eric M. Yeates
- Applicant: Sentry Solutions Products Group LLC
- Applicant Address: US VA Virginia Beach
- Assignee: Sentry Solutions Products Group LLC
- Current Assignee: Sentry Solutions Products Group LLC
- Current Assignee Address: US VA Virginia Beach
- Agency: Shaddock Law Group, PC
- International Application: PCT/US2018/024320 2018.03.26
- International Announcement: WO2018/183183A 2018.10.04
- Date entered country: 2019-05-20
- Main IPC: F41C33/02
- IPC: F41C33/02

Abstract:
An overmolded/through-molded holster, having one or more wall portions defining a holster body, wherein the holster body extends from a substantially open top portion to a bottom portion, and wherein the one or more wall portions define an at least partial holster cavity of the holster body; at least one overmold aperture formed through a portion of one or more of the one or more wall portions; and an overmolding material extending atop at least a portion of an exterior surface of the holster body, wherein at least a portion of the overmolding material extends through the at least one overmold aperture, such that at least a portion of the overmolding material extends through at least a portion of the at least one overmold aperture and into at least a portion of the at least partial holster cavity.
Public/Granted literature
- US20200011637A1 Overmolded / Through-Molded Holster Public/Granted day:2020-01-09
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