Invention Grant
- Patent Title: Structural electronics wireless sensor nodes
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Application No.: US17690596Application Date: 2022-03-09
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Publication No.: US11747265B2Publication Date: 2023-09-05
- Inventor: Brian L. Wardle , Yosef Stein , Estelle Cohen , Michael Murray
- Applicant: Analog Devices, Inc. , Massachusetts Institute of Technology
- Applicant Address: US MA Wilmington
- Assignee: Analog Devices, Inc.,Massachusetts Institute of Technology
- Current Assignee: Analog Devices, Inc.,Massachusetts Institute of Technology
- Current Assignee Address: US MA Wilmington; US MA Cambridge
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: G01N27/04
- IPC: G01N27/04 ; G01N27/22 ; G01N17/04

Abstract:
A structural electronics wireless sensor node is provided that includes layers of electronic components fabricated from patterned nanostructures embedded in an electrically conductive matrix. In some aspects, the structural electronics wireless sensor node includes a plurality of nanostructure layers that each form individual electronic components of the structural electronics wireless sensor node. In certain embodiments, the structural electronics wireless sensor node includes electronic components such as a resistor, a inductor, a capacitor, and/or an antenna.
Public/Granted literature
- US20220196542A1 STRUCTURAL ELECTRONICS WIRELESS SENSOR NODES Public/Granted day:2022-06-23
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