Invention Grant
- Patent Title: Probe substrate and electrical connecting apparatus
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Application No.: US17417183Application Date: 2019-10-18
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Publication No.: US11747365B2Publication Date: 2023-09-05
- Inventor: Toshinori Omori , Kazuya Goto , Yasuaki Osanai , Takashi Akiniwa , Takeki Sugisawa , Takeshi Kondo , Shintaro Abe , Maki Watanabe
- Applicant: KABUSHIKI KAISHA NIHON MICRONICS , TANAKA KIKINZOKU KOGYO K.K.
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA NIHON MICRONICS,TANAKA KIKINZOKU KOGYO K.K.
- Current Assignee: KABUSHIKI KAISHA NIHON MICRONICS,TANAKA KIKINZOKU KOGYO K.K.
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: BACON&THOMAS,PLLC
- Priority: JP 19004573 2019.01.15
- International Application: PCT/JP2019/041156 2019.10.18
- International Announcement: WO2020/148960A 2020.07.23
- Date entered country: 2021-12-09
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R1/067 ; G01R1/073 ; G01R31/28 ; G01R3/00 ; H01L21/48 ; H01L21/66

Abstract:
An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined.
A probe substrate according to the present disclosure includes: a plurality of electrical contactors respectively brought into electrical contact with a plurality of electrode terminals of a member to be inspected, a joint portion for a member to be joined is provided on one or each of a first surface and a second surface of the probe substrate and the member to be joined is joined to the joint portion with a metal layer that includes, in a metal component, at least 70 atomic percent or more of a transition metal and that is formed by sintering, and/or in a joining surface between a plurality of substrates of the probe substrate, the substrates are joined together with the metal layer formed by sintering, in the metal layer formed by sintering, a plurality of organic component parts and/or voids formed by heating an adhesive composition including a thermoplastic resin are left and the organic component parts and/or the voids included in the metal layer formed by sintering have 5 to 80 area percent in a vertical cross section of the metal layer formed by sintering.
A probe substrate according to the present disclosure includes: a plurality of electrical contactors respectively brought into electrical contact with a plurality of electrode terminals of a member to be inspected, a joint portion for a member to be joined is provided on one or each of a first surface and a second surface of the probe substrate and the member to be joined is joined to the joint portion with a metal layer that includes, in a metal component, at least 70 atomic percent or more of a transition metal and that is formed by sintering, and/or in a joining surface between a plurality of substrates of the probe substrate, the substrates are joined together with the metal layer formed by sintering, in the metal layer formed by sintering, a plurality of organic component parts and/or voids formed by heating an adhesive composition including a thermoplastic resin are left and the organic component parts and/or the voids included in the metal layer formed by sintering have 5 to 80 area percent in a vertical cross section of the metal layer formed by sintering.
Public/Granted literature
- US20220099702A1 PROBE SUBSTRATE AND ELECTRICAL CONNECTING APPARATUS Public/Granted day:2022-03-31
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