Invention Grant
- Patent Title: Head-mounted fixing device
-
Application No.: US17451929Application Date: 2021-10-22
-
Publication No.: US11747631B2Publication Date: 2023-09-05
- Inventor: Stephen Chen
- Applicant: E-LEAD ELECTRONIC CO., LTD.
- Applicant Address: TW Changhua
- Assignee: E-Lead Electronic Co., Ltd.
- Current Assignee: E-Lead Electronic Co., Ltd.
- Current Assignee Address: TW Changhua
- Agency: Wang Law Firm, Inc.
- Priority: TW 0210609 2021.09.08
- Main IPC: G02B27/01
- IPC: G02B27/01 ; G02C5/14 ; G02C5/22

Abstract:
A head-mounted fixing device includes a head frame, a bracket and a headband. Two side frame portions of the head frame abut against two sides of a user’s head, and a front frame portion of the head frame is located between the two side frame portions and abuts against the user’s forehead. The headband is movably connected to two first adjusting members of the head frame, so the position of the front frame portion on the forehead can be adjusted by adjusting positions of the two first adjusting members on the headband. The bracket abuts against the top of the head. The headband can wrap around and abut against the back of the head. The head frame, the bracket and the headband abut against the head to restrict the head-mounted fixing device from moving relative to the head, so that the head-mounted fixing device may be worn without shaking.
Public/Granted literature
- US20230071032A1 Head-Mounted Fixing Device Public/Granted day:2023-03-09
Information query