Invention Grant
- Patent Title: Synchronized parallel tile computation for large area lithography simulation
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Application No.: US17750828Application Date: 2022-05-23
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Publication No.: US11747786B2Publication Date: 2023-09-05
- Inventor: Danping Peng , Junjiang Lei , Daniel Beylkin , Kenneth Lik Kin Ho , Sagar Trivedi , Fangbo Xu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- The original application number of the division: US17170389 2021.02.08
- Main IPC: G06F30/392
- IPC: G06F30/392 ; G06F30/3308 ; G06F30/367 ; G03F1/70 ; G03F1/36 ; G03F1/24 ; G05B19/4097 ; G21K5/00 ; G06F111/20 ; G06F119/18

Abstract:
Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.
Public/Granted literature
- US20220291659A1 Synchronized Parallel Tile Computation for Large Area Lithography Simulation Public/Granted day:2022-09-15
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