Invention Grant
- Patent Title: Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
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Application No.: US17725181Application Date: 2022-04-20
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Publication No.: US11747789B2Publication Date: 2023-09-05
- Inventor: Naofumi Ohashi , Toshiyuki Kikuchi , Shun Matsui , Tadashi Takasaki
- Applicant: KOKUSAI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Priority: JP 18173540 2018.09.18
- Main IPC: G05B19/416
- IPC: G05B19/416 ; H01L21/677 ; H01L21/67

Abstract:
A substrate processing apparatus includes a plurality of storage containers mounted on a load port, each storage container storing a plurality of substrates; a plurality of process chambers for accommodating the substrates; a transfer part for transferring the substrates; a memory for storing data tables, including first count data, for the process chambers; an operation part, when multiple substrates in the first storage container is transferred to the process chambers in a predetermined order and performs a predetermined process in the process chambers in a state in which no substrate is present in a first process chamber, counting first count data for the first process chamber; and a controller assigns flag data to a data table of a process chamber having largest first count data and when multiple substrates in the second storage container is transferred, control the transfer part based on the flag data from a different process chamber.
Public/Granted literature
- US20220244707A1 SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM Public/Granted day:2022-08-04
Information query
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