Invention Grant
- Patent Title: Graphics processing integrated circuit package
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Application No.: US17826674Application Date: 2022-05-27
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Publication No.: US11748298B2Publication Date: 2023-09-05
- Inventor: Altug Koker , Farshad Akhbari , Feng Chen , Dukhwan Kim , Narayan Srinivasa , Nadathur Rajagopalan Satish , Liwei Ma , Jeremy Bottleson , Eriko Nurvitadhi , Joydeep Ray , Ping T. Tang , Michael S. Strickland , Xiaoming Chen , Tatiana Shpeisman , Abhishek R. Appu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: JAFFERY WATSON MENDONSA & HAMILTON LLP
- Main IPC: G06F15/80
- IPC: G06F15/80 ; G06F13/40 ; G06T1/20 ; G06F9/30 ; G06F13/00 ; G06N3/063 ; G06N3/084 ; G06N3/044 ; G06N3/045 ; G06N3/048
Abstract:
An integrated circuit (IC) package apparatus is disclosed. The IC package includes one or more processing units and a bridge, mounted below the one or more processing unit, including one or more arithmetic logic units (ALUs) to perform atomic operations.
Public/Granted literature
- US20230027203A1 GRAPHICS PROCESSING INTEGRATED CIRCUIT PACKAGE Public/Granted day:2023-01-26
Information query
