Invention Grant
- Patent Title: Light-emitting substrate and method for manufacturing the same, light-emitting apparatus and display apparatus
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Application No.: US17486624Application Date: 2021-09-27
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Publication No.: US11749217B2Publication Date: 2023-09-05
- Inventor: Tianyu Zhang , Min He , Tengfei Zhong , Xiaodong Xie , Xinxiu Zhang , Xue Zhao , Huayu Sang
- Applicant: HEFEI XiNSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Anhui
- Assignee: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Anhui; CN Beijing
- Agency: IP & T GROUP LLP
- Priority: CN 2011032315.6 2020.09.27
- Main IPC: G09G3/34
- IPC: G09G3/34

Abstract:
A light-emitting substrate includes a base and a plurality of light-emitting units disposed on the base. A light-emitting unit includes a driving voltage terminal, and a main driver chip pad group, a plurality of main light-emitting element pad groups connected in series and at least one spare light-emitting element pad group. Both ends of the plurality of main light-emitting element pad groups are coupled to the driving voltage terminal and the main driver chip pad group. Each spare light-emitting element pad group is connected in parallel with one of the plurality of main light-emitting element pad groups to constitute a pad unit.
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