Invention Grant
- Patent Title: Dustproof micro switch
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Application No.: US17893558Application Date: 2022-08-23
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Publication No.: US11749472B1Publication Date: 2023-09-05
- Inventor: Shenglong Ni
- Applicant: ZHEJIANG JIABEN ELECTRONICS CO., LTD.
- Applicant Address: CN Yueqing
- Assignee: ZHEJIANG JIABEN ELECTRONICS CO., LTD.
- Current Assignee: ZHEJIANG JIABEN ELECTRONICS CO., LTD.
- Current Assignee Address: CN Yueqing
- Agency: Fox Rothschild LLP
- Agent Carol Thorstad-Forsyth
- Priority: CN 2210176373.9 2022.02.25
- Main IPC: H01H13/06
- IPC: H01H13/06 ; H01H13/36 ; H01H13/50 ; H01H13/14

Abstract:
A dustproof micro switch is provided by the present disclosure, comprising a base body, an upper cover, and a button, wherein the base body and the upper cover form a box body; the upper cover is provided with a first half of through hole for the button, the base body is provided with a second half of through hole for the button, and the first half of through hole for the button and the second half of through hole for the button form a through hole for the button; one end of the button is arranged in the box body, and the other end of the button extends out of the box body through the through hole for the button; the end, extending out of the box body, of the button is provided with a sealing sleeve, and the movable contact arm support is arranged on the base body.
Public/Granted literature
- US20230274896A1 DUSTPROOF MICRO SWITCH Public/Granted day:2023-08-31
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