Invention Grant
- Patent Title: Method of removing phosphorus-doped silicon film and system therefor
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Application No.: US17304116Application Date: 2021-06-15
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Publication No.: US11749530B2Publication Date: 2023-09-05
- Inventor: Yoshihiro Takezawa , Masahisa Watanabe
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Priority: JP 20106427 2020.06.19
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/306 ; H01L21/02 ; H01L21/67

Abstract:
A method of removing a phosphorus-doped silicon film doped with phosphorus, includes: forming a silicon oxide film by oxidizing the phosphorus-doped silicon film in a substrate including the phosphorus-doped silicon film and an undoped silicon film which is not been doped with the phosphorus, wherein at least the phosphorus-doped silicon film is exposed to a surface of the substrate; and selectively etching and removing the silicon oxide film from the silicon oxide film and the undoped silicon film.
Public/Granted literature
- US20210398817A1 METHOD OF REMOVING PHOSPHORUS-DOPED SILICON FILM AND SYSTEM THEREFOR Public/Granted day:2021-12-23
Information query
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