Invention Grant
- Patent Title: Maskless etching of electronic substrates via precision dispense process
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Application No.: US17003667Application Date: 2020-08-26
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Publication No.: US11749539B1Publication Date: 2023-09-05
- Inventor: Richard Korneisel , Nathaniel P. Wyckoff , Brandon C. Hamilton , Kyle B. Snyder , Jenny Calubayan
- Applicant: Rockwell Collins, Inc.
- Applicant Address: US IA Cedar Rapids
- Assignee: Rockwell Collins, Inc.
- Current Assignee: Rockwell Collins, Inc.
- Current Assignee Address: US IA Cedar Rapids
- Agency: Suiter Swantz pc llo
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/306 ; H01L21/48
Abstract:
Systems and methods for selectively etching features in an electronic substrate via a precision dispense apparatus and precision etchant dispense tool are disclosed. The method includes creating a toolpath instruction for etching at least one feature in the substrate, programming the precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit etchant material onto the surface of the substrate to etch the substrate surface to produce the at least one feature according to the created toolpath instruction. The capabilities of the systems and methods disclosed herein extend to 3D substrates and post-build processing, among others.
Information query
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