Invention Grant
- Patent Title: Substrate-floatation-type laser processing apparatus and method for measuring floating height
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Application No.: US16888612Application Date: 2020-05-29
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Publication No.: US11749545B2Publication Date: 2023-09-05
- Inventor: Daisuke Hayashi , Takahiro Mikami , Yuki Suzuki
- Applicant: JSW AKTINA SYSTEM CO., LTD.
- Applicant Address: JP Yokohama
- Assignee: JSW AKTINA SYSTEM CO., LTD
- Current Assignee: JSW AKTINA SYSTEM CO., LTD
- Current Assignee Address: JP Yokohama
- Agency: Potomac Law Group, PLLC
- Priority: JP 19130992 2019.07.16
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B65G19/02 ; H01L21/02

Abstract:
A substrate-floatation-type laser processing apparatus and a method for measuring a floating height, capable of improving performance of laser processing are provided. A substrate-floatation-type laser processing apparatus according to an embodiment includes a stage configured to float and convey a substrate, and a floating-height measurement apparatus configured to measure a floating height H of the substrate. Note that a distance between the floating-height measurement apparatus and the substrate can be automatically adjusted according to the measured floating height H. The floating height H of the substrate is measured by applying laser light to the substrate and the stage. The distance between the floating-height measurement apparatus and the substrate is adjusted by using a feedback mechanism in which the measured floating height of the substrate is used as an input.
Public/Granted literature
- US20210020481A1 SUBSTRATE-FLOATATION-TYPE LASER PROCESSING APPARATUS AND METHOD FOR MEASURING FLOATING HEIGHT Public/Granted day:2021-01-21
Information query
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