Invention Grant
- Patent Title: Method for forming a pre-connection layer on a surface of a connection partner and method for monitoring a connection process
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Application No.: US17013923Application Date: 2020-09-08
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Publication No.: US11749568B2Publication Date: 2023-09-05
- Inventor: Sebastian Nordhoff
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP 196904 2019.09.12
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/00

Abstract:
A method for forming a connection between two connection partners includes: forming a pre-connection layer on a first surface of a first connection partner, the pre-connection layer including a certain amount of liquid; performing a pre-connection process, thereby removing liquid from the pre-connection layer; performing photometric measurements while performing the pre-connection process, wherein performing the photometric measurements includes determining at least one photometric parameter of the pre-connection layer, wherein the at least one photometric parameter changes depending on the fluid content of the pre-connection layer; and constantly evaluating the at least one photometric parameter, wherein the pre-connection process is terminated when the at least one photometric parameter is detected to be within a desired range.
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