Invention Grant
- Patent Title: Semiconductor module
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Application No.: US17519245Application Date: 2021-11-04
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Publication No.: US11749620B2Publication Date: 2023-09-05
- Inventor: Junji Tanaka
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: POSZ LAW GROUP, PLC
- Priority: JP 19091197 2019.05.14
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/485 ; H01L29/16 ; H01L29/45 ; H01L29/739 ; H01L29/78 ; H01L23/00
Abstract:
A semiconductor module includes: a semiconductor element; and a sealing member. The semiconductor element includes: a semiconductor substrate; a protection film on the semiconductor substrate; a metal film on the semiconductor substrate and having at least a part located between the semiconductor substrate and the protection film; and a dummy metal film on the semiconductor substrate between the metal film and the protection film. The surface of the semiconductor substrate has a recess. The protection film has an other recess or a hole. The dummy metal film is arranged in both the recess of the semiconductor substrate and the other recess or the hole of the protection film.
Public/Granted literature
- US20220059474A1 SEMICONDUCTOR MODULE Public/Granted day:2022-02-24
Information query
IPC分类:
