Invention Grant
- Patent Title: Electronic package including a hybrid thermal interface material and low temperature solder patterns to improve package warpage and reliability
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Application No.: US16879596Application Date: 2020-05-20
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Publication No.: US11749631B2Publication Date: 2023-09-05
- Inventor: Wei Chen , Jun Zhai , Kunzhong Hu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
Electronic packages and modules are described. In an embodiment, a hybrid thermal interface material including materials with different thermal conductivities is used to attach a lid to a device. In an embodiment, a low temperature solder material is included as part of an adhesion layer for attachment with a stiffener structure.
Public/Granted literature
Information query
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