A semiconductor manufacturing method of mounting a semiconductor chip or a stacked body of semiconductor chips on a support substrate placed on a stage, determines whether a predetermined condition is satisfied during a mounting processing of the semiconductor chip or the stacked body, evacuates, together with the support substrate, the semiconductor chip or the stacked body that has mounted on the support substrate before the determination when it is determined that the predetermined condition is satisfied, determines whether to resume the mounting processing of the semiconductor chip or the stacked body after the evacuation; and returns the evacuated semiconductor chip or the evacuated stacked body to a position before the evacuation and continuing the mounting processing when it is determined that the mounting processing is resumed.