Invention Grant
- Patent Title: Power switch for backside power distribution
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Application No.: US16877256Application Date: 2020-05-18
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Publication No.: US11749670B2Publication Date: 2023-09-05
- Inventor: Jack Liu
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee Address: TW Hsinchu
- Agency: Foley & Lardner LLP
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/06 ; H01L29/78 ; H01L27/02 ; G06F30/392 ; H01L21/8234 ; H01L23/528 ; G06F30/31 ; G06F117/12

Abstract:
Disclosed embodiments herein relate to an integrated circuit including power switches with active regions connected to form a contiguous region. In one aspect, the integrated circuit includes a first layer including a first metal rail extending in a first direction. In one aspect, the integrated circuit includes a second layer above the first layer along a second direction perpendicular to the first direction. The second layer may include active regions for power switches. In one aspect, the active regions of the power switches are connected to form a contiguous region extending in the first direction. The first metal rail may be electrically coupled to the active regions through via contacts. In one aspect, the integrated circuit includes a third layer above the second layer along the second direction. The third layer may include a second metal rail electrically coupled to some of the power switches through additional via contacts.
Public/Granted literature
- US20210358901A1 POWER SWITCH FOR BACKSIDE POWER DISTRIBUTION Public/Granted day:2021-11-18
Information query
IPC分类: