Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17143247Application Date: 2021-01-07
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Publication No.: US11749675B2Publication Date: 2023-09-05
- Inventor: Seiji Momota , Hitoshi Abe , Takashi Shiigi , Takeshi Fujii , Koh Yoshikawa , Tetsutaro Imagawa , Masaki Koyama , Makoto Asai
- Applicant: FUJI ELECTRIC CO., LTD. , DENSO CORPORATION
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.,DENSO CORPORATION
- Current Assignee: FUJI ELECTRIC CO., LTD.,DENSO CORPORATION
- Current Assignee Address: JP Kawasaki; JP Kariya
- Agency: WHDA, LLP
- Priority: JP 08018050 2008.01.29 JP 08160800 2008.06.19
- The original application number of the division: US15255713 2016.09.02
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/739 ; H01L29/78 ; H01L29/08 ; H01L29/10 ; H01L29/423 ; H01L29/06

Abstract:
Between a source electrode (25) of a main device (24) and a current sensing electrode (22) of a current detection device (21), a resistor for detecting current is connected. Dielectric withstand voltage of gate insulator (36) is larger than a product of the resistor and maximal current flowing through the current detection device (21) with reverse bias. A diffusion length of a p-body region (32) of the main device (24) is shorter than that of a p-body (31) of the current detection device (21). A curvature radius at an end portion of the p-body region (32) of the main device (24) is smaller than that of the p-body (31) of the current detection device (21). As a result, at the inverse bias, electric field at the end portion of the p-body region (32) of the main device (24) becomes stronger than that of the p-body region (31) of the current detection device (21). Consequently, avalanche breakdown tends to occur earlier in the main device 24 than the current detection device (21).
Public/Granted literature
- US20210134789A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-05-06
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