Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17377955Application Date: 2021-07-16
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Publication No.: US11749722B2Publication Date: 2023-09-05
- Inventor: Takuma Suzuki , Sozo Kanie , Chiharu Ota , Susumu Obata , Kazuhisa Goto
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Allen & Overy LLP
- Priority: JP 20122515 2020.07.17
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/78 ; H01L29/32 ; H01L29/66

Abstract:
A semiconductor device of embodiments includes a silicon carbide layer having a first face and a second face, a gate electrode, a gate insulating layer on the first face. The silicon carbide layer includes a first silicon carbide region of a first conductive type; a second silicon carbide region of a second conductive type disposed between the first silicon carbide region and the first face; a third silicon carbide region of a second conductive type between the first silicon carbide region and the first face; a fourth silicon carbide region; a fifth silicon carbide region; a sixth silicon carbide region of a second conductive type between the first silicon carbide region and the first face and between the second silicon carbide region and the third silicon carbide region; and a crystal defect. The crystal defect is in the sixth silicon carbide region.
Public/Granted literature
- US20220020853A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-01-20
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