Invention Grant
- Patent Title: High-frequency module
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Application No.: US17312046Application Date: 2019-11-27
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Publication No.: US11749873B2Publication Date: 2023-09-05
- Inventor: Hiroshi Hamada , Hideyuki Nosaka
- Applicant: Nippon Telegraph and Telephone Corporation
- Applicant Address: JP Tokyo
- Assignee: Nippon Telegraph and Telephone Corporation
- Current Assignee: Nippon Telegraph and Telephone Corporation
- Current Assignee Address: JP Tokyo
- Agency: Slater Matsil, LLP
- Priority: JP 18231609 2018.12.11
- International Application: PCT/JP2019/046371 2019.11.27
- International Announcement: WO2020/121815A 2020.06.18
- Date entered country: 2021-06-09
- Main IPC: H01P3/123
- IPC: H01P3/123 ; H01P1/207 ; H01P7/06 ; H01P1/211

Abstract:
A plurality of waveguide structures are loaded on a top surface opposed to a bottom surface of a metal case, on which a high-frequency circuit is mounted, a height, a width, and a length of each of the plurality of waveguide structures have dimensions corresponding to a quarter-wave of a cutoff frequency indicating a frequency band of a target electromagnetic wave to be blocked, and a width and a length of each of the plurality of waveguide structures have dimensions that allow only a high-frequency wave of a mode to propagate in the frequency band.
Public/Granted literature
- US20220029259A1 High-Frequency Module Public/Granted day:2022-01-27
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