Invention Grant
- Patent Title: Chip antenna and manufacturing method thereof
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Application No.: US17343235Application Date: 2021-06-09
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Publication No.: US11749875B2Publication Date: 2023-09-05
- Inventor: Chin Mo Kim , Sungyong An , Jae Yeong Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR 20210000885 2021.01.05
- Main IPC: H01Q1/00
- IPC: H01Q1/00 ; H01Q1/22 ; H05K1/18 ; H05K3/10 ; H01Q9/04 ; H05K1/11
Abstract:
A chip antenna includes a substrate having a concavo-convex pattern on a surface thereof, and a conductor pattern disposed on the surface of the substrate having the concavo-convex pattern, wherein a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern.
Public/Granted literature
- US20220216586A1 CHIP ANTENNA AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-07-07
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