Invention Grant
- Patent Title: Electronic device including high-frequency transmission circuit
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Application No.: US18090214Application Date: 2022-12-28
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Publication No.: US11749880B2Publication Date: 2023-09-05
- Inventor: Han-Min Cho , Chan-Gi Park , Yeon-Sang Yun , Tae-Wook Ham , Hei-Seong Kwak , Byoung-Il Son , Sung-Chul Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR 20160073355 2016.06.13
- The original application number of the division: US16939708 2020.07.27
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q5/35 ; H05K1/02 ; H01Q21/28 ; H01Q1/38 ; H01R12/79 ; H01R13/66 ; H05K1/11 ; H05K1/14 ; H05K1/18 ; H05K7/14

Abstract:
Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.
Public/Granted literature
- US20230134315A1 ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT Public/Granted day:2023-05-04
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