- Patent Title: Multi-layer antenna structure supporting wide band and wide angle
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Application No.: US17741225Application Date: 2022-05-10
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Publication No.: US11749884B2Publication Date: 2023-09-05
- Inventor: Tae Hwan Yoo
- Applicant: HJWAVE Co., Ltd.
- Applicant Address: KR Incheon
- Assignee: HJWAVE Co., Ltd.
- Current Assignee: HJWAVE Co., Ltd.
- Current Assignee Address: KR Incheon
- Agency: ANTONIO HA & U.S. PATENT, LLC
- Priority: KR 20210063506 2021.05.17 KR 20210063674 2021.05.17 KR 20210100845 2021.07.30 KR 20210148966 2021.11.02
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q13/10 ; H01Q1/42 ; H01Q5/371 ; H01Q13/18 ; H01Q13/12 ; H01Q13/22

Abstract:
According to an embodiment, a multi-layer antenna structure comprises a printed circuit board including an IC for processing an RF signal, a feeding line connected to the IC, and a feeding pad connected to the feeding line, a conductive lower layer tightly contacting the printed circuit board and including a feeding hole in an area connected with the feeding pad and vertically open and a waveguide connected to the feeding hole and disposed on an upper surface thereof, and a conductive upper layer tightly contacting the conductive lower layer and including an antenna slot pattern in an area corresponding to the waveguide and vertically open. The waveguide may include a bottom surface positioned lower than an upper surface thereof, a side surface extending from each of two opposite ends of the bottom surface to the upper surface, and a protrusion protruding upward from a center portion of the bottom surface.
Public/Granted literature
- US20220368011A1 MULTI-LAYER ANTENNA STRUCTURE SUPPORTING WIDE BAND AND WIDE ANGLE Public/Granted day:2022-11-17
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