Invention Grant
- Patent Title: Dual-band patch array antenna module and electronic device using the same
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Application No.: US17568673Application Date: 2022-01-04
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Publication No.: US11749905B2Publication Date: 2023-09-05
- Inventor: Ta-Fu Cheng , Cheng-Yi Wang , Ting-Wei Lin
- Applicant: Taiwan Inpaq electronic Co., Ltd.
- Applicant Address: TW Miaoli County
- Assignee: Taiwan Inpaq electronic Co., Ltd.
- Current Assignee: Taiwan Inpaq electronic Co., Ltd.
- Current Assignee Address: TW Miaoli County
- Agency: Li & Cai Intellectual Property Office
- Priority: TW 0137426 2021.10.08
- Main IPC: H01Q21/06
- IPC: H01Q21/06 ; H01Q1/38 ; H01Q1/52 ; H01Q9/04

Abstract:
A dual-band patch array antenna module and an electronic device using the same are provided. The dual-band patch array antenna module includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, a plurality of first band antenna structures, and a plurality of second band antenna structures. The common conductive metal layer is disposed inside the insulative carrier substrate. The common grounding metal layer is disposed on the insulative carrier substrate. The outer surrounding shielding structure is electrically connected between the common conductive metal layer and the common grounding metal layer. Each first band antenna structure includes a first radiator, two first metal elements, two first feeding elements, and two first inner surrounding shielding assemblies. Each second band antenna structure includes a second radiator, two second metal elements, two second feeding elements, and two second inner surrounding shielding assemblies.
Public/Granted literature
- US20230116495A1 DUAL-BAND PATCH ARRAY ANTENNA MODULE AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2023-04-13
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