- Patent Title: Encoded on-die termination for efficient multipackage termination
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Application No.: US17120729Application Date: 2020-12-14
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Publication No.: US11750190B2Publication Date: 2023-09-05
- Inventor: Sheldon G. Hiemstra , Veeresh Garag
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F13/40 ; G11C7/10 ; H03K19/00

Abstract:
On-die termination (ODT) is triggered through a serial signal encoding on an ODT signal line instead of a simple binary enable signal. An ODT circuit applies one of multiple termination impedances based on the ODT signal encoding. An ODT enable signal line receives an ODT enable signal as multiple serial bits to encode the selected termination impedance, to cause the ODT circuit to apply the selected termination impedance.
Public/Granted literature
- US20210175887A1 ENCODED ON-DIE TERMINATION FOR EFFICIENT MULTIPACKAGE TERMINATION Public/Granted day:2021-06-10
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