Invention Grant
- Patent Title: Radio-frequency module
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Application No.: US17227932Application Date: 2021-04-12
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Publication No.: US11750228B2Publication Date: 2023-09-05
- Inventor: Yoichi Sawada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 17067490 2017.03.30
- Main IPC: H04B1/00
- IPC: H04B1/00 ; H04L5/14

Abstract:
There is provided a radio-frequency module that can reduce communication signal loss in both the case of employing one communication band of multiple communication bands and the case of employing two or more communication bands together. A radio-frequency module includes a first switching circuit and matching circuits. The matching circuits are provided individually for a first transmission path, a second transmission path, and a third transmission path. When communications are performed by using only a first communication band, the first switching circuit selects the first transmission path. When communications are performed by using together the first communication band and the second communication band, the first switching circuit selects the second transmission path and the third transmission path.
Public/Granted literature
- US20210234558A1 RADIO-FREQUENCY MODULE Public/Granted day:2021-07-29
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