Invention Grant
- Patent Title: Method for multi-cloud interconnection and device
-
Application No.: US17858346Application Date: 2022-07-06
-
Publication No.: US11750496B2Publication Date: 2023-09-05
- Inventor: Xiaoping Zhu
- Applicant: Huawei Cloud Computing Technologies Co., Ltd.
- Applicant Address: CN Guizhou
- Assignee: HUAWEI CLOUD COMPUTING TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI CLOUD COMPUTING TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guizhou
- Agency: WOMBLE BOND DICKINSON (US) LLP
- Priority: CN 2010015135.0 2020.01.07
- Main IPC: H04L45/02
- IPC: H04L45/02 ; H04L43/0852 ; H04L67/10

Abstract:
This application discloses a method for multi-cloud interconnection, including: receiving identification information of a first device deployed on a first VPC; determining, based on the identification information of the first device, a first edge node, that is configured to connect to the first VPC, among a plurality of network nodes; sending identification information of the first edge node to the first device, where the identification information of the first edge node is used by the first device to create a connection between the first device and the first edge node; and determining a forwarding path that is between the first edge node and a second edge node and that is used to forward a packet between the first VPC and a second VPC, where the second edge node is a network node, that is configured to connect to the second VPC, among the plurality of network nodes.
Public/Granted literature
- US20220337506A1 METHOD FOR MULTI-CLOUD INTERCONNECTION AND DEVICE Public/Granted day:2022-10-20
Information query