Invention Grant
- Patent Title: Microelectromechanical system
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Application No.: US17168192Application Date: 2021-02-05
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Publication No.: US11750973B2Publication Date: 2023-09-05
- Inventor: Anup Patel , Euan James Boyd , Scott Lyall Cargill
- Applicant: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Current Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: W&G Law Group
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R3/02 ; B81B3/00

Abstract:
A microelectromechanical system includes an enclosure defining a cavity and an opening communicating with the cavity; a membrane mounted at the opening; a cantilever located within the cavity, the at least one cantilever comprising a first end, a second end and a fulcrum located between the first end and the second end; a plunger positioned between the membrane and the cantilever and configured to transfer displacement of the membrane to the first end of the cantilever; and a sensing member connected to the second end of the cantilever. The distance between the first end and the fulcrum is less than that between the second end and the fulcrum. The microelectromechanical system has the advantages of high SNR, small package size and high sensitivity. The membrane has a stiffness order of magnitude higher than a conventional membrane, which avoids mechanical collapse and large DC deformation under 1 atm.
Public/Granted literature
- US20220256284A1 MICROELECTROMECHANICAL SYSTEM Public/Granted day:2022-08-11
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