Invention Grant
- Patent Title: Electronic device
-
Application No.: US17257373Application Date: 2019-03-21
-
Publication No.: US11751319B2Publication Date: 2023-09-05
- Inventor: Hyunwoo Chung
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20180086742 2018.07.25
- International Application: PCT/KR2019/003302 2019.03.21
- International Announcement: WO2020/022607A 2020.01.30
- Date entered country: 2020-12-31
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; F21V8/00 ; H05K1/18
Abstract:
An electronic device is disclosed. The disclosed electronic device includes a printed circuit board including at least one through-hole, a holder which is positioned through the through-hole and protrudes upward and downward from the printed circuit board, and a solder layer for bonding one area of the holder to one surface of the printed circuit board.
Public/Granted literature
- US20210136910A1 ELECTRONIC DEVICE Public/Granted day:2021-05-06
Information query
