Invention Grant
- Patent Title: Electronic apparatus and inspection method
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Application No.: US17324784Application Date: 2021-05-19
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Publication No.: US11751326B2Publication Date: 2023-09-05
- Inventor: Mitsuaki Morimoto
- Applicant: SHARP KABUSHIKI KAISHA
- Applicant Address: JP Sakai
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Osaka
- Agency: ScienBiziP, P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; G01R1/073 ; G01R1/067 ; H05K1/18 ; H05K1/03

Abstract:
An electronic apparatus includes: an electronic module; and a flexible substrate electrically connected to the electronic module. The flexible substrate includes: a base film; a plurality of first contact pads arranged at one end on the base film in a first direction, and electrically connected to the electronic module; a plurality of second contact pads arranged at an other end on the base film in the first direction; a plurality of first wires arranged on the base film, and each electrically connecting one of the first contact pads and one of the second contact pads together; and a plurality of third contact pads arranged on the base film, each of the third contact pads being positioned along the first direction between one of the first contact pads and one of the second contact pads, and being electrically connected to one of the first wires.
Public/Granted literature
- US20210368617A1 ELECTRONIC APPARATUS AND INSPECTION METHOD Public/Granted day:2021-11-25
Information query