Invention Grant
- Patent Title: Apparatus including thermal management mechanism and methods of manufacturing the same
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Application No.: US17231994Application Date: 2021-04-15
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Publication No.: US11751357B2Publication Date: 2023-09-05
- Inventor: Suresh Reddy Yarragunta , Deepu Narasimiah Subhash
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.
Public/Granted literature
- US20220338378A1 APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2022-10-20
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