Invention Grant
- Patent Title: Liquid metal infiltration rework of electronic assembly
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Application No.: US17657775Application Date: 2022-04-04
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Publication No.: US11751369B2Publication Date: 2023-09-05
- Inventor: Mark K. Hoffmeyer , Timothy P. Younger
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Robert J. Shatto
- The original application number of the division: US16659750 2019.10.22
- Main IPC: B23K1/00
- IPC: B23K1/00 ; H05K13/04 ; B23K1/018
Abstract:
Provided is a method for removing an electronic component from a printed wiring board. The method comprises applying an embrittlement agent to a lead of an electronic component that is soldered to the printed wiring board. The electronic component is removed from the printed wiring board by breaking the embrittled lead.
Public/Granted literature
- US20220232746A1 LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY Public/Granted day:2022-07-21
Information query
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