Invention Grant
- Patent Title: 3D memory with confined cell
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Application No.: US17154615Application Date: 2021-01-21
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Publication No.: US11751407B2Publication Date: 2023-09-05
- Inventor: Erh-Kun Lai , Hsiang-Lan Lung
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes Beffel & Wolfeld LLP
- Agent Korbin S Van Dyke
- The original application number of the division: US16014346 2018.06.21
- Main IPC: H01L21/77
- IPC: H01L21/77 ; H10B63/00 ; G11C13/00 ; H10N70/20

Abstract:
A plurality of memory cells in a cross-point array in which the memory cell stacks in the cross-points include a switch element, a conductive barrier layer, and a confined cell structure in series, and having sides aligned within the cross-point area of the corresponding cross-point, the confined cell structure including surfactant spacers within the cross-point area having outside surfaces on a pair of opposing sides of the stack, and a body of programmable resistance memory material confined between inside surfaces of the surfactant spacers. The memory cells can be operated as multi-level cells in a 3D array.
Public/Granted literature
- US20210143216A1 3D MEMORY WITH CONFINED CELL Public/Granted day:2021-05-13
Information query
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