Invention Grant
- Patent Title: Expansion forming apparatus
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Application No.: US17175072Application Date: 2021-02-12
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Publication No.: US11752536B2Publication Date: 2023-09-12
- Inventor: Kei Yamauchi , Eiji Kouyama , Kiyomasa Koukami
- Applicant: SUMITOMO HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP 18186313 2018.10.01
- Main IPC: B21D26/10
- IPC: B21D26/10 ; B21D26/041

Abstract:
An expansion forming apparatus that shapes a metal material with a die includes an electrode that comes into contact with the metal material and performs energization heating, and an electrode mounting unit having an electrode movement actuator that moves the electrode along an extension direction of the metal material during heating.
Public/Granted literature
- US20210162481A1 EXPANSION FORMING APPARATUS Public/Granted day:2021-06-03
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