One object of the present invention is to provide a polyolefin resin foam sheet suitable as a sealing substrate having both flexibility and heat resistance despite its thinness, and an adhesive tape in which the polyolefin resin foam sheet is used. In order to achieve this, the polyolefin resin foam includes a thermoplastic elastomer, wherein the endothermic peaks measured by a differential scanning calorimeter (DSC) occur in the range of at least 110° C. or more and 143° C. or less and at 153° C. or more, and the thermoplastic elastomer resin is contained at a ratio of 30% by mass or more and 60% by mass or less in 100% by mass of the polyolefin resin.