Invention Grant
- Patent Title: Heat exchanger module, assembly-type heat exchanger including heat exchanger module, and heat exchanger assembly system
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Application No.: US16942303Application Date: 2020-07-29
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Publication No.: US11754350B2Publication Date: 2023-09-12
- Inventor: Wooram Hong , Jeonghun Kim , Hyundo Choi , Hyukju Kwon , Youngjin Park , Aram Jeon , Yongsik Jung , Wonje Choi , Taesin Ha
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20190168144 2019.12.16
- Main IPC: F28F9/26
- IPC: F28F9/26 ; F28F7/02 ; B25J9/16 ; B25J15/00
Abstract:
A heat exchanger module includes a first heat exchanging body including at least one first through hole and a second heat exchanging body including at least one second through hole. The second heat exchanging body is configured to be coupled to the first heat exchanging body, and an accommodation hole is provided between the first heat exchanging body and the second heat exchanging body by the first heat exchanging body and the second heat exchanging body being coupled together.
Public/Granted literature
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