Invention Grant
- Patent Title: Method of reducing friction-induced wear of pipe
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Application No.: US17853577Application Date: 2022-06-29
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Publication No.: US11754469B2Publication Date: 2023-09-12
- Inventor: Po Yao Li , Shao Chang Tu , Tsung-Ying Wu , Wei Chih Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- The original application number of the division: US16595045 2019.10.07
- Main IPC: G01M13/04
- IPC: G01M13/04 ; G01M13/045 ; F16L3/16 ; F16L3/02

Abstract:
A method of monitoring wear of a buffer includes holding a pipe for transporting a fluid and an electrical cable using a buffer placed on a support plate. The buffer includes a base, a plurality of fingers, and a roller contacting the support plate. The plurality of fingers includes a first finger, a second finger, and a third finger. The first finger and the second finger define a first cavity for receiving the pipe, and the second finger and the third finger defines a second cavity for receiving the electrical cable. The method includes detecting acoustic waves generated by the roller on the support plate. The method further includes analyzing changes in frequencies of the acoustic waves to determine an extent of the wear of the roller over time. The method includes triggering an alert when an increase in the frequencies of the acoustic waves exceeds a pre-determined threshold value.
Public/Granted literature
- US20220334028A1 METHOD OF REDUCING FRICTION-INDUCED WEAR OF PIPE Public/Granted day:2022-10-20
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