Invention Grant
- Patent Title: Ultrasonic device
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Application No.: US17248318Application Date: 2021-01-20
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Publication No.: US11754531B2Publication Date: 2023-09-12
- Inventor: Chikara Kojima , Kanechika Kiyose
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: CHIP LAW GROUP
- Priority: JP 20008954 2020.01.23
- Main IPC: G01N29/22
- IPC: G01N29/22 ; G01S7/521 ; G01N29/265 ; G01N29/24 ; G10K11/30

Abstract:
An ultrasonic device including: an element substrate including a diaphragm, a vibrator provided at the diaphragm, and a first electrode electrically coupled to the vibrator; a protective substrate that is provided at a position facing the element substrate and that includes a second electrode coupled to the first electrode at a position facing the first electrode; a through hole substrate that has a through hole and that faces the element substrate; and a container including a mounting surface on which the protective substrate is disposed, in which the vibrator is provided at a position overlapping the through hole when viewed from a facing direction in which the element substrate and the protective substrate face each other, and is surrounded by the element substrate, the protective substrate, and a jointing member, and the second electrode is provided at an opposite-side surface of the protective substrate from a jointing surface jointed with the mounting surface.
Public/Granted literature
- US20210231618A1 ULTRASONIC DEVICE Public/Granted day:2021-07-29
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