Invention Grant
- Patent Title: Method of forming resist pattern, resist composition and method of producing the same
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Application No.: US16678648Application Date: 2019-11-08
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Publication No.: US11754926B2Publication Date: 2023-09-12
- Inventor: Eiichi Shimura
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP 18214080 2018.11.14
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/32 ; G03F7/20 ; C08L65/02 ; C08L33/02 ; C08L33/14
Abstract:
A method of forming a resist pattern, including forming a resist composition using a resist film; exposing the resist film; and alkali-developing the exposed resist film to form a positive-tone resist pattern, wherein the resist composition includes a first resin component and a second resin component which satisfies a specific relationship DRMIX
Public/Granted literature
- US20200150541A1 METHOD OF FORMING RESIST PATTERN, RESIST COMPOSITION AND METHOD OF PRODUCING THE SAME Public/Granted day:2020-05-14
Information query
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