Invention Grant
- Patent Title: Soundproof structure and soundproof unit
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Application No.: US17176272Application Date: 2021-02-16
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Publication No.: US11756521B2Publication Date: 2023-09-12
- Inventor: Shinya Hakuta
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 18153519 2018.08.17
- Main IPC: G10K11/172
- IPC: G10K11/172

Abstract:
Provided are a soundproof structure and a soundproof unit that can be reduced in size and thickness in the soundproof structure using Helmholtz resonance. The soundproof structure that includes a housing forming a space therein and having a through hole that allows the space to communicate with an outside, and generates Helmholtz resonance by the space and the through hole, the soundproof structure includes a rear surface plate disposed at a position overlapping the through hole on the space side as viewed from a penetrating direction of the through hole, in which assuming that a diameter of the through hole is Φ and a distance from the rear surface plate to an opening surface of the through hole on the space side is d, d≤Φ is satisfied and d≤6 mm is satisfied.
Public/Granted literature
- US20210166671A1 SOUNDPROOF STRUCTURE AND SOUNDPROOF UNIT Public/Granted day:2021-06-03
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