Invention Grant
- Patent Title: Coil component
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Application No.: US16834274Application Date: 2020-03-30
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Publication No.: US11756720B2Publication Date: 2023-09-12
- Inventor: Seung Min Lee , Ju Hwan Yang , Yoon Mi Cha
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20190075124 2019.06.24
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/24 ; H01F27/32 ; H01F27/29 ; H01F27/30 ; H01F17/00

Abstract:
A coil component includes a coil portion embedded in a body, first and second lead-out portions connection to both end of the coil portion, respectively, and exposed from one surface of the body to be spaced apart from each other, and a support substrate supporting the coil portion and the first and second lead-out portions, and exposed from the one surface of the body. Each of the first and second lead-out portions includes a lead-out pattern and an auxiliary lead-out pattern disposed on one surface and the other surface of the support substrate, opposing each other, and exposed from the one surface of the body, respectively, and a connection via penetrating through the support substrate to connect the lead-out pattern and the auxiliary lead-out pattern to each other, and exposed from the one surface of the body.
Information query