Invention Grant
- Patent Title: Stencil structure and method of fabricating package
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Application No.: US17371020Application Date: 2021-07-08
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Publication No.: US11756801B2Publication Date: 2023-09-12
- Inventor: Jiun-Yi Wu , Chen-Hua Yu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L21/67
Abstract:
A method of fabrication a package and a stencil structure are provided. The stencil structure includes a first carrier having a groove and stencil units placed in the groove of the first carrier. At least one of the stencil units is slidably disposed along sidewalls of another stencil unit. Each of the stencil units has openings.
Public/Granted literature
- US20230009506A1 STENCIL STRUCTURE AND METHOD OF FABRICATING PACKAGE Public/Granted day:2023-01-12
Information query
IPC分类:
