Invention Grant
- Patent Title: Method for manufacturing body-source-tied SOI transistor
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Application No.: US17863925Application Date: 2022-07-13
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Publication No.: US11756823B2Publication Date: 2023-09-12
- Inventor: Allan K Calvo , Paul D Hurwitz , Roda Kanawati
- Applicant: Newport Fab, LLC
- Applicant Address: US CA Newport Beach
- Assignee: Newport Fab, LLC
- Current Assignee: Newport Fab, LLC
- Current Assignee Address: US CA Newport Beach
- Agency: Farjami & Farjami LLP
- The original application number of the division: US16928962 2020.07.14
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/762 ; H01L29/49 ; H01L23/66 ; H01L29/78 ; H01L29/423 ; H01L29/10 ; H01L29/66

Abstract:
A semiconductor-on-insulator (SOI) transistor includes a semiconductor layer situated over a buried oxide layer, the buried oxide layer being situated over a substrate. The SOI transistor is situated in the semiconductor layer and includes a transistor body, gate fingers, source regions, and drain regions. The transistor body has a first conductivity type. The source regions and the drain regions have a second conductivity type opposite to the first conductivity type. A heavily-doped body-implant region has the first conductivity type and overlaps at least one source region. A common silicided region electrically ties the heavily-doped body-implant region to the at least one source region. The common silicided region can include a source silicided region, and a body tie silicided region situated over the heavily-doped body-implant region. The source silicided region can be separated from a drain silicided region by the gate fingers.
Public/Granted literature
- US20220352007A1 Method For Manufacturing Body-Source-Tied SOI Transistor Public/Granted day:2022-11-03
Information query
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