Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17750409Application Date: 2022-05-23
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Publication No.: US11756962B2Publication Date: 2023-09-12
- Inventor: Yu-San Chien , Chun-Sheng Liang , Jhon-Jhy Liaw , Kuo-Hua Pan , Hsin-Che Chiang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238

Abstract:
Provided is a semiconductor device including a substrate, one hybrid fin, a gate, and a dielectric structure. The substrate includes at least two fins. The hybrid fin is disposed between the at least two fins. The gate covers portions of the at least two fins and the hybrid fin. The dielectric structure lands on the hybrid fin to divide the gate into two segment. The two segments are electrically isolated to each other by the dielectric structure and the hybrid fin. The hybrid fin includes a first portion, disposed between the two segments of the gate; and a second portion, disposed aside the first portion, wherein a top surface of the second portion is lower than a top surface of the first portion.
Public/Granted literature
- US20220278102A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-09-01
Information query
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