Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US17944853Application Date: 2022-09-14
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Publication No.: US11756994B2Publication Date: 2023-09-12
- Inventor: Toshiharu Marui , Tetsuya Hayashi , Keiichiro Numakura , Wei Ni , Ryota Tanaka , Keisuke Takemoto
- Applicant: NISSAN MOTOR CO., LTD. , RENAULT s.a.s.
- Applicant Address: JP Yokohama
- Assignee: NISSAN MOTOR CO., LTD.,RENAULT S.A.S.
- Current Assignee: NISSAN MOTOR CO., LTD.,RENAULT S.A.S.
- Current Assignee Address: JP Yokohama; FR Boulogne-Billancourt
- Agency: Foley & Lardner LLP
- The original application number of the division: US17423966
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/04 ; H01L21/76 ; H01L21/761 ; H01L29/16

Abstract:
A semiconductor device includes a semiconductor base body, and a first main electrode and a second main electrode provided on the semiconductor base body. The semiconductor base body includes a drift region of a first conductivity type through which a main current flows, a column region of a second conductivity type arranged adjacent to the drift region in parallel to a current passage of the main current, a second electrode-connection region of the first conductivity type electrically connected to the second main electrode, and a low-density electric-field relaxation region of the first conductivity type having a lower impurity concentration than the drift region and arranged between the second electrode-connection region and the column region.
Public/Granted literature
- US20230074093A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2023-03-09
Information query
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