- Patent Title: Formation of wrap-around-contact for gate-all-around nanosheet FET
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Application No.: US15959062Application Date: 2018-04-20
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Publication No.: US11756996B2Publication Date: 2023-09-12
- Inventor: Takashi Ando , Pouya Hashemi , Choonghyun Lee , Alexander Reznicek , Jingyun Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: McGinn I.P. Law Group, PLLC.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/423 ; H01L29/78 ; H01L29/66 ; H01L21/02

Abstract:
A semiconductor device includes a substrate material with a semiconductor material with a predetermined crystal orientation, a gate stack having a plurality of nanosheet channel layers, each nanosheet channel layer being controlled by metal gate layers located above and below the nanosheet channel layer, each nanosheet channel layer having the same semiconductor material and crystal orientation as that of the substrate, and a source/drain region on opposite sides of the gate stack. Each source/drain region includes bridging structures respectively connected to each nanosheet channel layer.
Public/Granted literature
- US20190326395A1 FORMATION OF WRAP-AROUND-CONTACT FOR GATE-ALL-AROUND NANOSHEET FET Public/Granted day:2019-10-24
Information query
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